Electronic component

ABSTRACT

An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic component, and more specifically, relates to an electronic component that includes a laminate including a plurality of laminated insulating material layers.

2. Description of the Related Art

As an existing electronic component, for example, a surface-mounted component described in Japanese Unexamined Patent Application Publication No. 2003-68569 is known. FIG. 11 is a cross-sectional structure diagram of an electronic device 500 that includes a surface-mounted component 510 described in Japanese Unexamined Patent Application Publication No. 2003-68569.

The electronic device 500 in FIG. 11 includes the surface-mounted component 510 and a mother substrate 523. The surface-mounted component 510 includes a module substrate 521, a land conductor 522, and an internal electrode 526. The module substrate 521 has a lamination structure including a conductor and a non-conductor. The land conductor 522 is provided on a bottom surface of the module substrate 521. The internal electrode 526 is provided within the module substrate 521 and faces the land conductor 522 across the non-conductor. The mother substrate 523 includes a corresponding electrode 524 and is a substrate on which the surface-mounted component 510 is mounted. The corresponding electrode 524 is provided on a top surface of the mother substrate 523. In the electronic device 500, the land conductor 522 and the corresponding electrode 524 are connected to each other by solder or the like, whereby the surface-mounted component 510 is mounted on the mother substrate 523.

In the surface-mounted component 510 as described above, the land conductor 522 and the internal electrode 526 face each other, thereby constituting a capacitor. Thus, a circuit within the module substrate 521 and the mother substrate 523 are electrically connected to each other via the capacitor.

However, the surface-mounted component 510 has a problem that it is difficult to have a desired capacitance value at the capacitor including the land conductor 522 and the internal electrode 526 as described below. More specifically, the land conductor 522 and the internal electrode 526 face each other so as to coincide with each other when seen in a planar view from the upper side. Thus, if the position where the land conductor 522 or the internal electrode 526 is printed shifts even slightly, the area of the portion where the land conductor 522 and the internal electrode 526 face each other is changed. As a result, the capacitance value of the capacitor including the land conductor 522 and the internal electrode 526 is changed.

SUMMARY OF THE INVENTION

Therefore, preferred embodiments of the present invention provide an electronic component that includes a capacitor having a desired capacitance value.

An electronic component according to an aspect of a preferred embodiment of the present invention includes a laminate including a plurality of laminated insulating material layers; a land electrode provided on a bottom surface of the laminate; a first capacitor conductor facing the land electrode across the insulating material layer within the laminate, having an area larger than that of the land electrode, and containing the land electrode when seen in a planar view from a lamination direction; and a second capacitor conductor provided on an upper side of the first capacitor conductor in the lamination direction and facing the first capacitor conductor.

According to a preferred embodiment of the present invention, even when a lamination shift occurs during a laminating process, an electronic component that includes a capacitor having a desired capacitance value can be obtained.

The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an external perspective view of an electronic component according to a first preferred embodiment of the present invention.

FIG. 2 is an exploded perspective view of the electronic component according to the first preferred embodiment of the present invention.

FIG. 3 is an equivalent circuit diagram of the electronic component according to the first preferred embodiment of the present invention.

FIG. 4 is an exploded perspective view of an electronic component according to a second preferred embodiment of the present invention.

FIG. 5 is an equivalent circuit diagram of the electronic component according to the second preferred embodiment of the present invention.

FIG. 6 is a diagram in which insulating material layers are laminated.

FIG. 7 is a graph showing an experimental result.

FIG. 8 is a diagram in which insulating material layers are laminated.

FIG. 9 is an exploded perspective view of an electronic component according to a third preferred embodiment of the present invention.

FIG. 10 is an equivalent circuit diagram of the electronic component according to the third preferred embodiment of the present invention.

FIG. 11 is a cross-sectional structure diagram of an electronic device including a surface-mounted component described in Japanese Unexamined Patent Application Publication No. 2003-68569.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, an electronic component according to preferred embodiments of the present invention will be described with reference to the drawings.

First preferred Embodiment

Hereinafter, the configuration of an electronic component according to a first preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of the electronic component 10 according to the first preferred embodiment of the present invention. FIG. 2 is an exploded perspective view of the electronic component 10 according to the first preferred embodiment of the present invention. FIG. 3 is an equivalent circuit diagram of the electronic component 10 according to the first preferred embodiment of the present invention. Hereinafter, a lamination direction of the electronic component 10 is defined as a z-axis direction. In addition, when the electronic component 10 is seen in a planar view from the z-axis direction, a direction along the long sides of the electronic component 10 is defined as an x-axis direction, and a direction along the short sides of the electronic component 10 is defined as a y-axis direction.

As shown in FIGS. 1 and 2, the electronic component 10 includes a laminate 12, land electrodes 14 (14 a to 14 c), internal conductors 18 (18 a to 18 m), a ground conductor 19, and via-hole conductors b (b1 to b41).

As shown in FIG. 2, the laminate 12 includes a plurality of laminated rectangular insulating material layers 16 (16 a to 16 i) and has a rectangular parallelepiped shape. Each insulating material layer 16 has a rectangular or substantially rectangular shape and is preferably formed from, for example, a Ba—Al—Si ceramic dielectric material. The insulating material layers 16 a to 16 i are laminated in order from the positive direction side to the negative direction side in the z-axis direction. Hereinafter, the principal surface of each insulating material layer 16 on the positive direction side in the z-axis direction is referred to as a front surface, and the principal surface of each insulating material layer 16 on the negative direction side in the z-axis direction is referred to as a back surface.

The land electrodes 14 a to 14 c are provided on the back surface of the insulating material layer 16 i (the bottom surface of the laminate 12) and each have a rectangular or substantially rectangular shape extending in the y-axis direction. In other words, the electronic component 10 has a so-called LGA (Land Grid Array) structure. It should be noted that for easy understanding, in FIG. 2, the land electrodes 14 a to 14 c are shown in a state where the land electrodes 14 a to 14 c are separated from the back surface of the insulating material layer 16 i. The land electrodes 14 a to 14 c are aligned in order from the negative direction side to the positive direction side in the x-axis direction. The land electrode 14 a is used as an input terminal. The land electrode 14 b is used as a ground terminal. The land electrode 14 c is used as an output terminal.

The internal conductors 18 and the ground conductor 19 are preferably formed from a conductive material containing Cu as a principal component and are provided on the front surfaces of the insulating material layers 16. The via-hole conductors b are formed preferably by filling via holes extending through the insulating material layers 16 in the z-axis direction with a conductive material containing Cu as a principal component. The land electrodes 14, the internal conductors 18, the ground conductor 19, and the via-hole conductors b constitute coils Ls1 to Ls3 and capacitors Cs1 to Cs3, Cm1, Cm2, and Cp1 (see FIG. 3) included in the laminate 12 as described below.

As shown in FIGS. 2 and 3, the coil Ls1 includes the internal conductors 18 a and 18 d and the via-hole conductors b1 to b3 and b8 to b13. More specifically, the internal conductors 18 a and 18 d are provided on the front surfaces of the insulating material layers 16 b and 16 c, respectively, and each have an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the positive direction side in the x-axis direction. The internal conductor 18 a and the internal conductor 18 d preferably have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b1 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 a to an end of the internal conductor 18 d. The via-hole conductor b8 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 a to another end of the internal conductor 18 d. Thus, the internal conductors 18 a and 18 d are connected to each other.

The via-hole conductors b2 and b3 extend through the insulating material layers 16 c and 16 d, respectively, in the z-axis direction. The via-hole conductors b2 and b3 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b2 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 d. The end of the via-hole conductor b3 on the negative direction side in the z-axis direction is connected to an end of the internal conductor 18 h.

The via-hole conductors b9 to b13 extend through the insulating material layers 16 c to 16 g in the z-axis direction. The via-hole conductors b9 to b13 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b9 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 d.

As described above, the coil Ls1 preferably is a loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The internal conductor 18 l is provided on the front surface of the insulating material layer 16 i and has a rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 l faces the land electrode 14 a across the insulating material layer 16 i within the laminate 12, has an area larger than that of the land electrode 14 a, and contains the land electrode 14 a when seen from the positive direction side in the z-axis direction (the lamination direction).

The capacitor Cs1 preferably includes the internal conductors 18 h and 18 l and the ground conductor 19. The internal conductor 18 h is provided on the front surface of the insulating material layer 16 e and has a T shape including a portion extending in the y-axis direction and a portion projecting from the center of the portion in the y-axis direction toward the positive direction side in the x-axis direction. The ground conductor 19 is provided on the insulating material layer 16 h and has a cross shape. The ground conductor 19 is provided on the negative direction side of the internal conductor 18 h in the z-axis direction (on the lower side thereof in the lamination direction) and on the positive direction side of the internal conductor 18 l in the z-axis direction (on the upper side thereof in the lamination direction). The internal conductor 18 h and the ground conductor 19 face each other across the insulating material layers 16 e, 16 f, and 16 g, and the internal conductor 18 l and the ground conductor 19 face each other across the insulating material layer 16 h. Thus, the capacitor Cs1 is provided between the internal conductors 18 h and 18 l and the ground conductor 19.

The via-hole conductors b4 to b7 extend through the insulating material layers 16 e to 16 h in the z-axis direction. The via-hole conductors b4 to b7 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b4 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b3 on the negative direction side in the z-axis direction. The end of the via-hole conductor b7 on the negative direction side in the z-axis direction is connected to the internal conductor 181. In addition, the end of the via-hole conductor b13 on the negative direction side in the z-axis direction is connected to the ground conductor 19. Thus, the coil Ls1 and the capacitor Cs1 are connected in parallel, thereby constituting an LC parallel resonator LC1.

In addition, the via-hole conductor b14 extends through the insulating material layer 16 i in the z-axis direction. The end of the via-hole conductor b14 on the positive direction side in the z-axis direction is connected to the internal conductor 18 l. The end of the via-hole conductor b14 on the negative direction side in the z-axis direction is connected to the land electrode 14 a. Thus, the LC parallel resonator LC1 including the coil Ls1 and the capacitor Cs1 is connected to the land electrode 14 a via the via-hole conductor b14.

In addition, the via-hole conductors b15 and b16 extend through the insulating material layers 16 h and 16 i in the z-axis direction. The via-hole conductors b15 and b16 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b15 on the positive direction side in the z-axis direction is connected to the ground conductor 19. The end of the via-hole conductor b16 on the negative direction side is connected to the land electrode 14 b. Thus, the LC parallel resonator LC1 including the coil Ls1 and the capacitor Cs1 is connected to the land electrode 14 b via the via-hole conductors b15 and b16.

As shown in FIGS. 2 and 3, the coil Ls2 including the internal conductors 18 b and 18 e and the via-hole conductors b31 to b34 and b36 to b41. More specifically, the internal conductors 18 b and 18 e are provided on the front surfaces of the insulating material layers 16 b and 16 c and on the positive direction sides of the internal conductors 18 a and 18 d in the x-axis direction, respectively and each have a rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 b and the internal conductor 18 e preferably have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b31 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 b to an end of the internal conductor 18 e. The via-hole conductor b36 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 b to another end of the internal conductor 18 e. Thus, the internal conductors 18 b and 18 e are connected to each other.

The via-hole conductors b32 to b34 extend through the insulating material layers 16 c to 16 e, respectively, in the z-axis direction. The via-hole conductors b32 to b34 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b32 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 e.

The via-hole conductors b37 to b41 extend through the insulating material layers 16 c to 16 g in the z-axis direction. The via-hole conductors b37 to b41 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b37 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 e.

As described above, the coil Ls2 preferably is a loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The capacitor Cs2 preferably includes the internal conductors 18 j and 18 k and the ground conductor 19. The internal conductors 18 j and 18 k are provided on the front surfaces of the insulating material layers 16 f and 16 g, respectively and each have a rectangular or substantially rectangular shape. The via-hole conductor b35 extends through the insulating material layer 16 f in the z-axis direction. The end of the via-hole conductor b35 on the positive direction side in the z-axis direction is connected to the internal conductor 18 j. The end of the via-hole conductor b35 on the negative direction side in the z-axis direction is connected to the internal conductor 18 k. The internal conductor 18 j and the ground conductor 19 face each other across the insulating material layers 16 f and 16 g. The internal conductor 18 k and the ground conductor 19 face each other across the insulating material layer 16 g. Thus, the capacitor Cs2 is provided between the internal conductors 18 j and 18 k and the ground conductor 19.

The end of the via-hole conductor b34 on the negative direction side in the z-axis direction is connected to the internal conductor 18 j. In addition, the end of the via-hole conductor b41 on the negative direction side in the z-axis direction is connected to the ground conductor 19. Thus, the coil Ls2 and the capacitor Cs2 are connected in parallel, thereby constituting an LC parallel resonator LC2. In addition, the LC parallel resonator LC2 including the coil Ls2 and the capacitor Cs2 is connected to the land electrode 14 b via the via-hole conductors b15 and b16.

As shown in FIGS. 2 and 3, the coil Ls3 preferably includes the internal conductors 18 c and 18 f and the via-hole conductors b17 to b19 and b24 to b29. More specifically, the internal conductors 18 c and 18 f are provided on the front surfaces of the insulating material layers 16 b and 16 c, respectively, and each have an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the negative direction side in the x-axis direction. The internal conductor 18 c and the internal conductor 18 f have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b17 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 c to an end of the internal conductor 18 f. The via-hole conductor b24 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 c to another end of the internal conductor 18 f. Thus, the internal conductors 18 c and 18 f are connected to each other.

The via-hole conductors b18 and b19 extend through the insulating material layers 16 c and 16 d, respectively, in the z-axis direction. The via-hole conductors b18 and b19 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b18 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 f. The end of the via-hole conductor b19 on the negative direction side in the z-axis direction is connected to the end of the internal conductor 18 i.

The via-hole conductors b25 to b29 extend through the insulating material layers 16 c to 16 g in the z-axis direction. The via-hole conductors b25 to b29 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b25 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 f.

As described above, the coil Ls3 preferably is a loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The internal conductor 18 m is provided on the front surface of the insulating material layer 16 i and has a rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 m faces the land electrode 14 c across the insulating material layer 16 i within the laminate 12, has an area larger than that of the land electrode 14 c, and contains the land electrode 14 c when seen from the positive direction side in the z-axis direction (the lamination direction).

The capacitor Cs3 preferably includes the internal conductors 18 i and 18 m and the ground conductor 19. The internal conductor 18 i is provided on the front surface of the insulating material layer 16 e and has a T shape including a portion extending in the y-axis direction and a portion projecting from the center of the portion in the y-axis direction toward the negative direction side in the x-axis direction. The ground conductor 19 is provided on the negative direction side of the internal conductor 18 i in the z-axis direction (on the lower side thereof in the lamination direction) and on the positive direction side of the internal conductor 18 m in the z-axis direction (on the upper side thereof in the lamination direction). The internal conductor 18 i and the ground conductor face each other across the insulating material layers 16 e, 16 f, and 16 g, and the internal conductor 18 m and the ground conductor 19 face each other across the insulating material layer 16 h. Thus, the capacitor Cs3 is provided between the internal conductors 18 i and 18 m and the ground conductor 19.

The via-hole conductors b20 to b23 extend through the insulating material layers 16 e to 16 h in the z-axis direction. The via-hole conductors b20 to b23 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b20 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b19 on the negative direction side in the z-axis direction. The end of the via-hole conductor b23 on the negative direction side in the z-axis direction is connected to the internal conductor 18 m. In addition, the end of the via-hole conductor b29 on the negative direction side in the z-axis direction is connected to the ground conductor 19. Thus, the coil Ls3 and the capacitor Cs3 are connected in parallel, thereby constituting an LC parallel resonator LC3.

In addition, the via-hole conductor b30 extends through the insulating material layer 16 i in the z-axis direction. The end of the via-hole conductor b30 on the positive direction side in the z-axis direction is connected to the internal conductor 18 m. The end of the via-hole conductor b30 on the negative direction side in the z-axis direction is connected to the land electrode 14 c. Thus, the LC parallel resonator LC3 including the coil Ls3 and the capacitor Cs3 is connected to the land electrode 14 c via the via-hole conductor b30. In addition, the LC parallel resonator LC3 including the coil Ls3 and the capacitor Cs3 is connected to the land electrode 14 b via the via-hole conductors b15 and b16.

The capacitor Cm1 including the internal conductor 18 h and the internal conductor 18 j. The internal conductor 18 h and the internal conductor 18 j face each other across the insulating material layer 16 e. Thus, the capacitor Cm1 is provided between the internal conductors 18 h and 18 j.

The capacitor Cm2 preferably includes the internal conductor 18 i and the internal conductor 18 j. The internal conductor 18 i and the internal conductor 18 j face each other across the insulating material layer 16 e. Thus, the capacitor Cm2 is provided between the internal conductors 18 i and 18 j.

The capacitor Cp1 preferably includes the internal conductor 18 g and the internal conductors 18 h and 18 i. The internal conductor 18 g is provided on the front surface of the insulating material layer 16 d and has a rectangular or substantially rectangular shape extending in the x-axis direction. The internal conductor 18 g and the internal conductors 18 h and 18 i face each other across the insulating material layer 16 d. Thus, two capacitors are provided between the internal conductors 18 h and 18 g and between the internal conductors 18 g and 18 i. These two capacitors are connected in series, thereby constituting the capacitor Cp1.

The electronic component 10 configured as described above is used as, for example, a band-pass filter. More specifically, the impedances of the LC parallel resonators LC1 to LC3 become maximum at their resonant frequencies. Thus, the LC parallel resonators LC1 to LC3 do not pass high-frequency signals having frequencies around their resonant frequencies. In other words, high-frequency signals having frequencies around the resonant frequencies of the LC parallel resonators LC1 to LC3 do not flow from the external electrode 14 a to the external electrode 14 b and flow from the external electrode 14 a to the external electrode 14 c. On the other hand, the impedances of the LC parallel resonators LC1 to LC3 are relatively low at frequencies other than the frequencies around the resonant frequencies of the LC parallel resonators LC1 to LC3. Thus, the frequencies other than the frequencies around the resonant frequencies of the LC parallel resonators LC1 to LC3 pass through the LC parallel resonators LC1 to LC3 and flow to the ground via the external electrode 14 b. As described above, the electronic component 10 serves as a band-pass filter that passes only high-frequency signals having frequencies around the resonant frequencies of the LC parallel resonators LC1 to LC3.

In the electronic component 10, desired capacitance values can be obtained at the capacitors Cs1 and Cs3 having desired capacitance values. More specifically, the internal conductors 18 l and 18 m face the land electrodes 14 a and 14 c, respectively, across the insulating material layer 16 i within the laminate 12, have areas larger than those of the land electrodes 14 a and 14 c, respectively, and contain the land electrodes 14 a and 14 c, respectively, when seen from the positive direction side in the z-axis direction (the lamination direction). Thus, even when the positions where the internal conductors 18 l, 18 m, 18 h, and 18 i constituting the capacitors Cs1 and Cs3 or the land electrodes 14 a and 14 c are printed shift slightly, a state is kept in which the land electrodes 14 a and 14 c are contained in the internal conductors 18 l and 18 m when seen in a planar view from the z-axis direction. Thus, in the electronic component 10, formation of capacitances due to the land electrodes 14 a and 14 c protruding from the internal conductors 18 l and 18 m to face the ground electrode 19 is significantly reduced and prevented. Therefore, deviation of the capacitors Cs1 and Cs3 from the desired capacitance values is significantly reduced and prevented.

In addition, in the electronic component 10, even when the capacitors Cs1 and Cs3 having desired capacitance values are obtained, insulation between the land electrodes 14 a to 14 c can be kept. More specifically, when the areas of the land electrodes 14 a and 14 c are increased in order to obtain desired capacitance values, the intervals between the land electrodes 14 a to 14 c decrease. Meanwhile, when the electronic component 10 is mounted on a substrate, the land electrodes 14 a to 14 c are connected to lands on the substrate by means of solder. Thus, when the intervals between the land electrodes 14 a to 14 c decrease, there is the possibility that the land electrodes 14 a to 14 c are connected to each other via solder when being mounted by means of solder. In other words, the insulation between the land electrodes 14 a to 14 c is not kept.

Thus, in the electronic component 10, the areas of the internal conductors 18 l and 18 m are larger than the areas of the land electrodes 14 a and 14 c. Since the internal conductors 18 l and 18 m are included in the electronic component 10, the internal conductors 18 l and 18 m are not mounted via solder like the land electrodes 14 a to 14 c. Thus, when the electronic component 10 is mounted onto a substrate, there is no possibility that a short circuit occurs between the internal conductors 18 l and 18 m. Thus, it is easy to make the internal conductors 18 l and 18 m close to each other as compared to the land electrodes 14 a to 14 c. In other words, it is easy to make the internal conductors 18 l and 18 m large in size as compared to the land electrodes 14 a to 14 c. Due to the above, in the electronic component 10, even when the capacitors Cs1 and Cs3 having desired capacitance values are obtained, the insulation between the land electrodes 14 a to 14 c can be kept.

Second Preferred Embodiment

Hereinafter, the configuration of an electronic component 10 a according to a second preferred embodiment will be described with reference to the drawings. FIG. 4 is an exploded perspective view of the electronic component 10 a according to the second preferred embodiment. FIG. 5 is an equivalent circuit diagram of the electronic component 10 a according to the second preferred embodiment. It should be noted that for an external perspective view of the electronic component 10 a, FIG. 1 is used. It should be noted that among the elements of the electronic component 10 a, the same elements as those of the electronic component 10 are designated by the same reference signs.

As shown in FIG. 4, the electronic component 10 a includes a laminate 12, land electrodes 14 (14 a to 14 c), internal conductors 18 (18 a to 18 g, 18 l, and 18 m) and 38 (38 a to 38 h), ground conductors 39 (39 a and 39 b), and via-hole conductors b (b51 to b97).

As shown in FIG. 4, the laminate 12 includes a plurality of laminated rectangular insulating material layers 16 (16 a to 16 j) and preferably has a rectangular or substantially rectangular parallelepiped shape. Each insulating material layer 16 has a rectangular or substantially rectangular shape and is formed from, for example, a Ba—Al—Si ceramic dielectric material. The insulating material layers 16 a to 16 j are laminated in order from the positive direction side to the negative direction side in the z-axis direction. Hereinafter, the principal surface of each insulating material layer 16 on the positive direction side in the z-axis direction is referred to as a front surface, and the principal surface of each insulating material layer 16 on the negative direction side in the z-axis direction is referred to as a back surface.

The land electrodes 14 a to 14 c are provided on the back surface of the insulating material layer 16 j (the bottom surface of the laminate 12) and each have a rectangular or substantially rectangular shape extending in the y-axis direction. In other words, the electronic component 10 a has a so-called LGA (Land Grid Array) structure. It should be noted that for easy understanding, in FIG. 4, the land electrodes 14 a to 14 c are shown in a state where the land electrodes 14 a to 14 c are separated from the back surface of the insulating material layer 16 j. The land electrodes 14 a to 14 c are aligned in order from the negative direction side to the positive direction side in the x-axis direction. The land electrode 14 a is used as an input terminal. The land electrode 14 b is used as a ground terminal. The land electrode 14 c is used as an output terminal.

The internal conductors 18 and 38 and the ground conductors 39 are preferably made of a conductive material containing Cu as a principal component and are provided on the front surfaces of the insulating material layers 16. The via-hole conductors b are formed preferably by filling via holes extending through the insulating material layers 16 in the z-axis direction with a conductive material containing Cu as a principal component. The land electrodes 14, the internal conductors 18 and 38, the ground conductors 39, and the via-hole conductors b constitute coils Ls1 to Ls3 and capacitors Cs1 to Cs3, Cm1, Cm2, and Cp1 (see FIG. 5) included in the laminate 12 as described below.

As shown in FIGS. 4 and 5, the coil Ls1 includes the internal conductors 18 a and 18 d and the via-hole conductors b51 to b53 and b57 to b61. More specifically, the internal conductors 18 a and 18 d are provided on the front surfaces of the insulating material layers 16 b and 16 c, respectively, and each have an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the positive direction side in the x-axis direction. The internal conductor 18 a and the internal conductor 18 d preferably have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b51 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 a to an end of the internal conductor 18 d. The via-hole conductor b57 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 a to another end of the internal conductor 18 d. Thus, the internal conductors 18 a and 18 d are connected to each other.

The via-hole conductors b52 and b53 extend through the insulating material layers 16 c and 16 d, respectively, in the z-axis direction. The via-hole conductors b52 and b53 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b52 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 d.

The via-hole conductors b58 to b61 extend through the insulating material layers 16 c to 16 f in the z-axis direction. The via-hole conductors b58 to b61 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b58 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 d.

As described above, the coil Ls1 preferably is a loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The internal conductor 18 l is provided on the front surface of the insulating material layer 16 j and has a rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 l faces the land electrode 14 a across the insulating material layer 16 j within the laminate 12, has an area larger than that of the land electrode 14 a, and contains the land electrode 14 a when seen from the positive direction side in the z-axis direction (the lamination direction). No conductor layer is provided between the internal conductor 18 l and the land electrode 14 a.

The capacitor Cs1 preferably includes the internal conductors 18 l, 38 c, and 38 f and the ground conductors 39 a and 39 b. The internal conductors 38 c and 38 f are provided on the front surfaces of the insulating material layers 16 f and 16 h, respectively, and each have a rectangular or substantially rectangular shape extending in the y-axis direction. The ground conductor 39 a is provided on the front surface of the insulating material layer 16 g and has a T shape including a portion extending in the x-axis direction and a portion projecting from the center of the portion in the x-axis direction toward the negative direction side in the y-axis direction. The ground conductor 39 b is provided on the front surface of the insulating material layer 16 i and has a rectangular or substantially rectangular or substantially rectangular shape. It should be noted that the ground conductor 39 b is provided with a cut A1 recessed from the side (outer rim) on the negative direction side in the x-axis direction toward the positive direction side in the x-axis direction and a cut A2 recessed from the side (outer rim) on the positive direction side in the x-axis direction toward the negative direction side in the x-axis direction.

Here, the shapes of the cuts A1 and A2 in the electronic component 10 a will be described with reference to the drawing. FIG. 6 is a diagram in which the insulating material layers 16 h to 16 j are laminated. It should be noted that for easy understanding, the internal conductor 38 g is omitted.

The depths D1 and D2 of the cuts A1 and A2 in the x-axis direction are larger than the widths D3 and D4, respectively, in the x-axis direction, of the portions of the internal conductors 18 l, 18 m, 38 f, and 38 h that overlap the cuts A1 and A2.

Furthermore, the ground conductor 39 b is provided on the positive direction side of the internal conductor 18 l in the z-axis direction (on the upper side thereof in the lamination direction). In addition, the internal conductor 38 f is provided on the positive direction side of the ground conductor 39 b in the z-axis direction (on the upper side thereof in the lamination direction). Thus, the internal conductor 18 l and the ground conductor 39 b face each other across the insulating material layer 16 i. Similarly, the internal conductor 38 f and the ground conductor 39 b face each other across the insulating material layer 16 h. In other words, capacitances are provided between the internal conductors 18 l and 38 f and the ground conductor 39 b, respectively.

Furthermore, the ground conductor 39 a is provided on the positive direction side of the internal conductor 38 f in the z-axis direction (on the upper side thereof in the lamination direction). In addition, the internal conductor 38 c is provided on the positive direction side of the ground conductor 39 a in the z-axis direction (on the upper side thereof in the lamination direction). Thus, the internal conductor 38 f and the ground conductor 39 a face each other across the insulating material layer 16 g. Similarly, the internal conductor 38 c and the ground conductor 39 a face each other across the insulating material layer 16 f. In other words, capacitances are provided between the internal conductors 38 c and 38 f and the ground conductor 39 a, respectively.

In addition, the via-hole conductors b54 to b56 extend through the insulating material layers 16 e to 16 g in the z-axis direction. The via-hole conductors b54 to b56 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b54 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b53 on the negative direction side in the z-axis direction. The end of the via-hole conductor b54 on the negative direction side in the z-axis direction is connected to the internal conductor 38 c. The end of the via-hole conductor b56 on the negative direction side in the z-axis direction is connected to the internal conductor 38 f.

In addition, the via-hole conductors b64 and b65 extend through the insulating material layers 16 h and 16 i in the z-axis direction. The via-hole conductors b64 and b65 are connected in series, thereby constituting a single via-hole conductor. The via-hole conductors b64 and b65 extend through the inside of the cut A1. The end of the via-hole conductor b64 on the positive direction side in the z-axis direction is connected to the internal conductor 38 f. The end of the via-hole conductor b65 on the negative direction side in the z-axis direction is connected to the internal conductor 18 l. In other words, the via-hole conductors b64 and b65 connect the internal conductor 18 l to the internal conductor 38 f.

Since the internal conductors 18 l, 38 c, and 38 f are connected as described above, four capacitors including the internal conductors 18 l, 38 c, and 38 f and the ground conductors 39 a and 39 b are connected. By the four capacitors, the capacitor Cs1 is provided.

In addition, as described above, the end of the via-hole conductor b65 on the negative direction side in the z-axis direction is connected to the internal conductor 18 l. Furthermore, the via-hole conductors b62 and b63 extend through the insulating material layers 16 g and 16 h in the z-axis direction. The via-hole conductors b62 and b63 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b62 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b61 on the negative direction side in the z-axis direction. The end of the via-hole conductor b63 on the negative direction side in the z-axis direction is connected to the ground conductor 39 b. Thus, the coil Ls1 and the capacitor Cs1 are connected in parallel, thereby constituting an LC parallel resonator LC1.

In addition, the via-hole conductor b66 extends through the insulating material layer 16 j in the z-axis direction. The end of the via-hole conductor b66 on the positive direction side in the z-axis direction is connected to the internal conductor 18 l. The end of the via-hole conductor b66 on the negative direction side in the z-axis direction is connected to the land electrode 14 a. Thus, the LC parallel resonator LC1 including the coil Ls1 and the capacitor Cs1 is connected to the land electrode 14 a via the via-hole conductor b66.

In addition, the via-hole conductors b67 and b68 extend through the insulating material layers 16 i and 16 j in the z-axis direction. The via-hole conductors b67 and b68 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b67 on the positive direction side in the z-axis direction is connected to the ground conductor 39 b. The end of the via-hole conductor b68 on the negative direction side in the z-axis direction is connected to the land electrode 14 b. Thus, the LC parallel resonator LC1 including the coil Ls1 and the capacitor Cs1 is connected to the land electrode 14 b via the via-hole conductors b67 and b68.

As shown in FIGS. 4 and 5, the coil Ls2 preferably includes the internal conductors 18 b and 18 e and the via-hole conductors b85 to b88 and b91 to b95. More specifically, the internal conductors 18 b and 18 e are provided on the front surfaces of the insulating material layers 16 b and 16 c and on the positive direction sides of the internal conductors 18 a and 18 d in the x-axis direction, respectively, and each have a rectangular or substantially rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 b and the internal conductor 18 e have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b85 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 b to an end of the internal conductor 18 e. The via-hole conductor b91 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 b to another end of the internal conductor 18 e. Thus, the internal conductors 18 b and 18 e are connected in parallel.

The via-hole conductors b86 to b88 extend through the insulating material layers 16 c to 16 e, respectively, in the z-axis direction. The via-hole conductors b86 to b88 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b86 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 e.

The via-hole conductors b92 to b95 extend through the insulating material layers 16 c to 16 f in the z-axis direction. The via-hole conductors b92 to b95 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b92 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 e.

As described above, the coil Ls2 preferably is a loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The capacitor Cs2 preferably includes the internal conductors 38 d and 38 g and the ground conductors 39 a and 39 b. The internal conductors 38 d and 38 g are provided on the front surfaces of the insulating material layers 16 f and 16 h, respectively and each preferably have a T shape, for example. The via-hole conductors b89 and b90 extend through the insulating material layers 16 f and 16 g in the z-axis direction. The via-hole conductors b89 and b90 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b89 on the positive direction side in the z-axis direction is connected to the internal conductor 38 d. The end of the via-hole conductor b90 on the negative direction side in the z-axis direction is connected to the internal conductor 38 g. The internal conductors 38 d and 38 g and the ground conductor 39 a face each other across the insulating material layers 16 f and 16 g. The internal conductor 38 g and the ground conductor 39 b face each other across the insulating material layer 16 h. Thus, the capacitor Cs2 is provided between the internal conductors 38 d and 38 g and the ground conductors 39 a and 39 b.

The end of the via-hole conductor b88 on the negative direction side in the z-axis direction is connected to the internal conductor 38 d. In addition, the end of the via-hole conductor b95 on the negative direction side in the z-axis direction is connected to the ground conductor 39 a. Furthermore, the via-hole conductors b96 and b97 extend through the insulating material layers 16 g and 16 h in the z-axis direction. The via-hole conductors b96 and b97 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b96 on the positive direction side in the z-axis direction is connected to the ground conductor 39 a. The end of the via-hole conductor b97 on the negative direction side in the z-axis direction is connected to the ground conductor 39 b. Thus, the coil Ls2 and the capacitor Cs2 are connected in parallel, thereby constituting an LC parallel resonator LC2. In addition, the LC parallel resonator LC2 including the coil Ls2 and the capacitor Cs2 is connected to the land electrode 14 b via the via-hole conductors b67 and b68.

As shown in FIGS. 4 and 5, the coil Ls3 preferably includes the internal conductors 18 c and 18 f and the via-hole conductors b69 to b71 and b75 to b79. More specifically, the internal conductors 18 c and 18 f are provided on the front surfaces of the insulating material layers 16 b and 16 c, respectively, and each have an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the negative direction side in the x-axis direction. The internal conductor 18 c and the internal conductor 18 f have the same shape and overlap each other so as to coincide with each other when seen in a planar view from the z-axis direction. In addition, the via-hole conductor b69 extends through the insulating material layer 16 b in the z-axis direction and connects an end of the internal conductor 18 c to an end of the internal conductor 18 f. The via-hole conductor b75 extends through the insulating material layer 16 b in the z-axis direction and connects another end of the internal conductor 18 c to another end of the internal conductor 18 f. Thus, the internal conductors 18 c and 18 f are connected to each other.

The via-hole conductors b70 and b71 extend through the insulating material layers 16 c and 16 d, respectively, in the z-axis direction. The via-hole conductors b70 and b71 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b70 on the positive direction side in the z-axis direction is connected to the end of the internal conductor 18 f.

The via-hole conductors b76 to b79 extend through the insulating material layers 16 c to 16 f in the z-axis direction. The via-hole conductors b76 to b79 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b76 on the positive direction side in the z-axis direction is connected to the other end of the internal conductor 18 f.

As described above, the coil Ls3 preferably is loop coil having a substantially U shape when seen in a planar view from the positive direction side in the x-axis direction.

The internal conductor 18 m is provided on the front surface of the insulating material layer 16 j and has a rectangular or substantially rectangular shape extending in the y-axis direction. The internal conductor 18 m faces the land electrode 14 c across the insulating material layer 16 j within the laminate 12, has an area larger than that of the land electrode 14 c, and contains the land electrode 14 c when seen from the positive direction side in the z-axis direction (the lamination direction). No conductor layer is provided between the internal conductor 18 m and the land electrode 14 c.

The capacitor Cs3 preferably includes the internal conductors 18 m, 38 e, and 38 h and the ground conductors 39 a and 39 b. The internal conductors 38 e and 38 h are provided on the front surfaces of the insulating material layers 16 f and 16 h, respectively, and each have a rectangular or substantially rectangular shape extending in the y-axis direction.

Furthermore, the ground conductor 39 b is provided on the positive direction side of the internal conductor 18 m in the z-axis direction (on the upper side thereof in the lamination direction). In addition, the internal conductor 38 h is provided on the positive direction side of the ground conductor 39 b in the z-axis direction (on the upper side thereof in the lamination direction). Thus, the internal conductor 18 m and the ground conductor 39 b face each other across the insulating material layer 16 i. Similarly, the internal conductor 38 h and the ground conductor 39 b face each other across the insulating material layer 16 h. In other words, capacitances are provided between the internal conductors 18 m and 28 h and the ground conductor 39 b, respectively.

Furthermore, the ground conductor 39 a is provided on the positive direction side of the internal conductor 38 h in the z-axis direction (on the upper side thereof in the lamination direction). In addition, the internal conductor 38 e is provided on the positive direction side of the ground conductor 39 a in the z-axis direction (on the upper side thereof in the lamination direction). Thus, the internal conductor 38 h and the ground conductor 39 a face each other across the insulating material layer 16 g. Similarly, the internal conductor 38 e and the ground conductor 39 a face each other across the insulating material layer 16 f. In other words, capacitances are provided between the internal conductors 38 e and 38 h and the ground conductor 39 a, respectively.

In addition, the via-hole conductors b72 to b74 extend through the insulating material layers 16 e to 16 g in the z-axis direction. The via-hole conductors b72 to b74 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b72 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b71 on the negative direction side. The end of the via-hole conductor b72 on the negative direction side in the z-axis direction is connected to the internal conductor 38 e. The end of the via-hole conductor b74 on the negative direction side in the z-axis direction is connected to the internal conductor 38 h.

In addition, the via-hole conductors b82 and b83 extend through the insulating material layers 16 h and 16 i in the z-axis direction. The via-hole conductors b82 and b83 are connected in series, thereby constituting a single via-hole conductor. The via-hole conductors b82 and b83 extend through the inside of the cut A2. The end of the via-hole conductor b82 on the positive direction side in the z-axis direction is connected to the internal conductor 38 h. The end of the via-hole conductor b83 on the negative direction side in the z-axis direction is connected to the internal conductor 18 m. In other words, the via-hole conductors b82 and b83 connect the internal conductor 18 m to the internal conductor 38 h.

Since the internal conductors 18 m, 38 e, and 38 h are connected as described above, four capacitors including the internal conductors 18 m, 38 e, and 38 h and the ground conductors 39 a and 39 b are preferably connected, for example. By the four capacitances, the capacitor Cs3 is provided.

In addition, as described above, the end of the via-hole conductor b83 on the negative direction side in the z-axis direction is connected to the internal conductor 18 m. Furthermore, the via-hole conductors b80 and b81 extend through the insulating material layers 16 g and 16 h in the z-axis direction. The via-hole conductors b80 and b81 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b80 on the positive direction side in the z-axis direction is connected to the end of the via-hole conductor b79 on the negative direction side in the z-axis direction. The end of the via-hole conductor b81 on the negative direction side in the z-axis direction is connected to the ground conductor 39 b. Thus, the coil Ls3 and the capacitor Cs3 are connected in parallel, thereby constituting an LC parallel resonator LC3.

In addition, the via-hole conductor b84 extends through the insulating material layer 16 j in the z-axis direction. The end of the via-hole conductor b84 on the positive direction side in the z-axis direction is connected to the internal conductor 18 m. The end of the via-hole conductor b84 on the negative direction side in the z-axis direction is connected to the land electrode 14 c. Thus, the LC parallel resonator LC3 including the coil Ls3 and the capacitor Cs3 is connected to the land electrode 14 c via the via-hole conductor b84.

In addition, the via-hole conductors b67 and b68 extend through the insulating material layers 16 i and 16 j in the z-axis direction. The via-hole conductors b67 and b68 are connected in series, thereby constituting a single via-hole conductor. The end of the via-hole conductor b67 on the positive direction side in the z-axis direction is connected to the ground conductor 39 b. The end of the via-hole conductor b68 on the negative direction side is connected to the land electrode 14 b. Thus, the LC parallel resonator LC3 including the coil Ls3 and the capacitor Cs3 is connected to the land electrode 14 b via the via-hole conductors b67 and b68.

The capacitor Cm1 preferably includes the internal conductor 38 a and the internal conductor 38 d. The internal conductor 38 a is provided on the front surface of the insulating material layer 16 e and has an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the positive direction side in the x-axis direction. In addition, the internal conductor 38 a is connected to the via-hole conductors b53 and b54. As described above, the internal conductor 38 d is provided on the front surface of the insulating material layer 16 f and has a T shape. In addition, the internal conductor 38 d is connected to the via-hole conductors b88 and b89. The internal conductor 38 a and the internal conductor 38 d face each other across the insulating material layer 16 e. Thus, the capacitor Cm1 is provided between the internal conductor 38 a and 38 d.

The capacitor Cm2 preferably includes the internal conductor 38 b and the internal conductor 38 d. The internal conductor 38 b is provided on the front surface of the insulating material layer 16 e and has an L shape extending in the y-axis direction and bending at an end on the positive direction side in the y-axis direction to the negative direction side in the x-axis direction. In addition, the internal conductor 38 b is connected to the via-hole conductors b71 and b72. As described above, the internal conductor 38 d is provided on the front surface of the insulating material layer 16 f and has a T shape. The internal conductor 38 b and the internal conductor 38 d face each other across the insulating material layer 16 e. Thus, the capacitor Cm2 is provided between the internal conductors 38 b and 38 d.

The capacitor Cp1 preferably includes the internal conductor 18 g and the internal conductors 38 a and 38 b. The internal conductor 18 g is provided on the front surface of the insulating material layer 16 d and has a rectangular or substantially rectangular shape extending in the x-axis direction. The internal conductor 18 g and the internal conductors 38 a and 38 b face each other across the insulating material layer 16 d. Thus, two capacitors are formed between the internal conductor 38 a and 18 g and between the internal conductors 18 g and 38 b. These two capacitors are connected in series, thereby constituting the capacitor Cp1.

The electronic component 10 a configured as described above is also preferably used as, for example, a band-pass filter. It should be noted that the operation of the electronic component 10 a is the same as the operation of the electronic component 10, and thus the description thereof is omitted.

In the electronic component 10 a, similarly to the electronic component 10, desired capacitance values can be obtained at the capacitors Cs1 and Cs3 having desired capacitance values. Furthermore, in the electronic component 10 a, similarly to the electronic component 10, even when the capacitors Cs1 and Cs3 having desired capacitance values are obtained, insulation between the land electrodes 14 a to 14 c can be maintained.

In addition, according to the electronic component 10 a, even when the insulating material layers 16 h to 16 j shift in the x-axis direction in laminating the insulating material layers 16 h to 16 j, the capacitance values of the capacitors Cs1 and Cs3 are unlikely to vary. More specifically, as shown in FIG. 6, the depths D1 and D2 of the cuts A1 and A2 in the x-axis direction are larger than the widths D3 and D4, respectively, in the x-axis direction, of the portions of the internal conductors 18 l, 18 m, 38 f, and 38 h that overlaps the cuts A1 and A2. Thus, even when the insulating material layers 16 h to 16 j shift slightly in the x-axis direction, the areas of the portions where the internal conductors 18 l, 18 m, 38 f, and 38 h and the ground conductor 39 b face each other do not change. As a result, according to the electronic component 10 a, even when the insulating material layers 16 h to 16 j shift in the x-axis direction in laminating the insulating material layers 16 h to 16 j, the capacitance values of the capacitors Cs1 and Cs3 are unlikely to vary.

In order to demonstrate that variations of the capacitance values of the capacitors Cs1 and Cs3 can be significantly reduced and prevented, the inventor of the preferred embodiments of the present invention described and claimed in the present application conducted an experiment described below. Specifically, the electronic component 10 a was produced as a first sample, and an electronic component in which the cuts A1 and A2 are not provided was produced as a second sample. The configuration other than the cuts A1 and A2 in the second sample is the same as that in the first sample. The relationship between frequency and insertion loss was checked using the first sample and the second sample. FIG. 7 is a graph showing the experimental result. The vertical axis indicates insertion loss, and the horizontal axis indicates frequency.

According to FIG. 7, it appears that in the second sample, in the passband of high-frequency signals, the insertion loss is greater than that in the first sample. This is thought to be because in the second sample, a lamination shift occurs and the capacitance values of the capacitors Cs1 and Cs3 are decreased. Thus, according to the electronic component 10 a, it is recognized that the capacitance values of the capacitors Cs1 and Cs3 are unlikely to vary.

In addition, in the electronic component 10 a, variations of the capacitance values of the capacitors Cs1 to Cs3 can be significantly reduced and prevented. More specifically, each of the capacitors Cs1 to Cs3 preferably includes a plurality of parallel-connected capacitors defined by a plurality of the internal conductors 18 and 38 and a plurality of the ground conductors 39. Thus, the capacitance values of the plurality of capacitors constituting each of the capacitors Cs1 to Cs3 are relatively small. Therefore, even when the capacitance value of one capacitor among the plurality of capacitors varies due to a lamination shift or the like, the variation amounts of the capacitance values of the capacitors Cs1 to Cs3 are relatively small. Thus, in the electronic component 10 a, variations of the capacitance values of the capacitors Cs1 to Cs3 can be significantly reduced and prevented.

Modified Example

Hereinafter, internal conductors 18′l, 18′m, 38′f, and 38′h and a ground conductor 39′b according to a modified example of a preferred embodiment of the present invention will be described with reference to the drawing. FIG. 8 is a diagram in which insulating material layers 16 h to 16 j are laminated.

As shown in FIG. 8, the depths D1 and D2 of the cuts A1 and A2 in the x-axis direction are larger than the widths D3 and D4, respectively, in the x-axis direction, of the portions of the internal conductors 18′l, 18′m, 38′f, and 38′h that overlap the cuts A1 and A2. It should be noted that the widths D3 and D4, in the x-axis direction, of the portions of the internal conductors 18′l, 18′m, 38′f, and 38′h that overlap the cuts A1 and A2 are smaller than the widths D5 and D6, in the x-axis direction, of the other portions of the internal conductors 18′l, 18′m, 38′f, and 38′h. Thus, the depths D1 and D2 of the cuts A1 and A2 in the x-axis direction can be decreased.

Third Preferred Embodiment

Hereinafter, the configuration of an electronic component 10 b according to a third preferred embodiment will be described with reference to the drawings. FIG. 9 is an exploded perspective view of the electronic component 10 b according to the third preferred embodiment. FIG. 10 is an equivalent circuit diagram of the electronic component 10 b according to the third preferred embodiment. It should be noted that for an external perspective view of the electronic component 10 b, FIG. 1 is used. In addition, among the elements of the electronic component 10 b, the same elements as those of the electronic component 10 are designated by the same reference signs.

The difference between the electronic component 10 b and the electronic component 10 is the presence/absence of the via-hole conductors b14 and b30. More specifically, as shown in FIG. 9, in the electronic component 10 b, no via-hole conductor is provided between a land electrode 14 a and an internal electrode 18 l. Thus, the land electrode 14 a and the internal electrode 18 l face each other across an insulating material layer 16 i in a state of being insulated from each other. Therefore, a capacitor Cx1 is provided between the land electrode 14 a and the internal electrode 18 l. In addition, no via-hole conductor is provided between a land electrode 14 c and an internal electrode 18 m. Thus, the land electrode 14 c and the internal electrode 18 m face each other across the insulating material layer 16 i in a state of being insulated from each other. Therefore, a capacitor Cx2 is provided between the land electrode 14 c and the internal electrode 18 m.

The electronic component 10 b configured as described above is preferably used as, for example, a band-pass filter. It should be noted that the operation of the electronic component 10 b is the same as the operation of the electronic component 10, and thus the description thereof is omitted.

In the electronic component 10 b, similarly to the electronic component 10, desired capacitance values can be obtained at the capacitors Cs1 and Cs3.

In addition, according to the electronic component 10 b, even when the land electrodes 14 a and 14 c slightly shift in printing the land electrodes 14 a and 14 c, the capacitance values of the capacitors Cx1 and Cx2 are unlikely to vary. More specifically, the internal conductors 18 l and 18 m face the land electrodes 14 a and 14 c, respectively, across the insulating material layer 16 i within the laminate 12, have areas larger than those of the land electrodes 14 a and 14 c, respectively, and contain the land electrodes 14 a and 14 c, respectively, when seen from the positive direction side in the z-axis direction (the lamination direction). Therefore, even when the internal conductors 18 l and 18 m or the land electrodes 14 a and 14 c constituting the capacitors Cx1 and Cx2 slightly shift, the areas of the portions where the internal conductors 18 l and 18 m face the land electrodes 14 a and 14 c do not change. As a result, in the electronic component 10 b, even when the land electrodes 14 a and 14 c slightly shift in printing the land electrodes 14 a and 14 c, the capacitance values of the capacitors Cx1 and Cx2 are unlikely to vary.

Furthermore, according to the electronic component 10 b, even when the positions where the land electrodes 14 a and 14 c are printed slightly shift, a state is kept in which the land electrodes 14 a and 14 c are contained in the internal conductors 18 l and 18 m when seen in a planar view from the z-axis direction. Because of this, in the electronic component 10, formation of capacitances due to the land electrodes 14 a and 14 c protruding from the internal conductors 18 l and 18 m to face the ground electrode 19 is significantly reduced and prevented. Therefore, deviation of the capacitors Cx1 and Cx2 from the desired capacitance values is significantly reduced and prevented, and change of the characteristics of the electronic component 10 b due to an unnecessary capacitance can be prevented.

As described above, preferred embodiments of the present invention are useful for electronic components, and in particular, are excellent in that a capacitor having a desired capacitance value can be obtained.

While preferred embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims. 

1. (canceled)
 2. An electronic component comprising: a laminate including a plurality of insulating layers laminated on each other in a lamination direction; a land electrode provided at a lower portion of the laminate; a first capacitor conductor facing the land electrode across a first of the insulating layers; a second capacitor conductor provided above the first capacitor conductor in the lamination direction and facing the first capacitor conductor across a second of the insulating layers; a third capacitor conductor provided above the second capacitor conductor in the lamination direction and facing the second capacitor conductor across a third of the insulating layers; and a first via-hole conductor connecting the first capacitor conductor to the third capacitor conductor; wherein an area where the first capacitor conductor and the third capacitor conductor overlap each other in the lamination direction overlaps a first portion of the second of the insulating layers that contains the second capacitor conductor and a second portion of the second of the insulating layers that does not contain the second capacitor conductor; the first via-hole conductor extends through the second portion of the second of the insulating layers that does not contain the second capacitor conductor.
 3. The electronic component according to claim 2, wherein a dimension of the second portion of the second of the insulating layers that does not contain the second capacitor conductor is larger than a width of the third capacitor conductor.
 4. The electronic component according to claim 3, wherein the dimension extends from an outer edge of the second of the insulating layers to an edge of the second capacitor conductor closest to the third capacitor conductor across the width of the third capacitor conductor.
 5. The electronic component according to claim 2, wherein the first via-hole conductor is spaced apart from the first portion of the second of the insulating layers that contains the second capacitor conductor in a direction that is perpendicular to the lamination direction.
 6. The electronic component according to claim 2, wherein the second portion of the second of the insulating layers that does not contain the second capacitor conductor is located at an outer portion of the second of the insulating layers.
 7. The electronic component according to claim 2, wherein the second of the insulating layers is rectangular or substantially rectangular.
 8. The electronic component according to claim 2, wherein the second capacitor conductor is rectangular or substantially rectangular and includes a recessed portion that corresponds to a location of the second portion of the second of the insulating layers that does not contain the second capacitor conductor.
 9. The electronic component according to claim 2, wherein no conductor layer is provided between the land electrode and the first capacitor conductor.
 10. The electronic component according to claim 2, wherein the second capacitor conductor is a ground conductor.
 11. The electronic component according to claim 2, further comprising a second via-hole conductor connecting the land electrode to the first capacitor conductor.
 12. An electronic component comprising: a laminate including a plurality of insulating layers laminated on each other in a lamination direction; a land electrode provided at a lower portion of the laminate; a first capacitor conductor facing the land electrode across a first of the insulating layers; a second capacitor conductor provided above the first capacitor conductor in the lamination direction and facing the first capacitor conductor across a second of the insulating layers; a third capacitor conductor provided above the second capacitor conductor in the lamination direction and facing the second capacitor conductor across a third of the insulating layers; and a first via-hole conductor connecting the first capacitor conductor to the third capacitor conductor; wherein the second capacitor conductor is rectangular or substantially rectangular and includes a recessed portion that corresponds to a location of a first portion of the second of the insulating layers that does not contain the second capacitor conductor; the first via-hole conductor extends through the first portion of the second of the insulating layers that does not contain the second capacitor conductor.
 13. The electronic component according to claim 12, wherein the recessed portion is recessed inwardly toward a center of the second capacitor conductor by a distance that is greater than a width of the third capacitor conductor.
 14. The electronic component according to claim 13, wherein the first via-hole conductor is spaced apart from a second portion of the second of the insulating layers that contains the second capacitor conductor in a direction that is perpendicular to the lamination direction.
 15. The electronic component according to claim 12, wherein the first portion of the second of the insulating layers that does not contain the second capacitor conductor is located at an outer portion of the second of the insulating layers.
 16. The electronic component according to claim 12, wherein the second of the insulating layers is rectangular or substantially rectangular.
 17. The electronic component according to claim 12, wherein no conductor layer is provided between the land electrode and the first capacitor conductor.
 18. The electronic component according to claim 12, wherein the second capacitor conductor is a ground conductor.
 19. The electronic component according to claim 12, further comprising a second via-hole conductor connecting the land electrode to the first capacitor conductor.
 20. An electronic component comprising: a laminate including a plurality of insulating layers laminated on each other in a lamination direction; a land electrode provided at a lower portion of the laminate; a first capacitor conductor facing the land electrode across a first of the insulating layers; a second capacitor conductor provided above the first capacitor conductor in the lamination direction and facing the first capacitor conductor across a second of the insulating layers on which the second capacitor conductor is located; a third capacitor conductor provided above the second capacitor conductor in the lamination direction and facing the second capacitor conductor across a third of the insulating layers; and a first via-hole conductor connecting the first capacitor conductor to the third capacitor conductor; wherein the first via-hole conductor extends from the first capacitor conductor to the third capacitor conductor through a portion of the second of the insulating layers that does not contain the second capacitor conductor; the portion of the second of the insulating layers that does not contain the second capacitor conductor is larger than another portion of the second of the insulating layers that does not contain the second capacitor conductor.
 21. The electronic component according to claim 20, wherein a dimension of the portion of the second of the insulating layers that does not contain the second capacitor conductor is larger than a width of the third capacitor conductor.
 22. The electronic component according to claim 20, wherein the portion of the second of the insulating layers that does not contain the second capacitor conductor through which the first via-hole conductor extends is a located at an outer portion of the second of the insulating layers.
 23. The electronic component according to claim 20, wherein the portion of the second of the insulating layers that does not contain the second capacitor conductor through which the first via-hole conductor extends is adjacent to the second capacitor conductor on at least two sides thereof.
 24. The electronic component according to claim 20, wherein the portion of the second of the insulating layers that does not contain the second capacitor conductor through which the first via-hole conductor extends is spaced apart from the second capacitor conductor in a direction that is perpendicular to the lamination direction.
 25. The electronic component according to claim 20, wherein the second capacitor conductor is rectangular or substantially rectangular and includes a recessed portion that corresponds to a location of the portion of the second of the insulating layers that does not contain the second capacitor conductor. 